Bid Number: 367-OC5392
Bid Title: 2023 Affordable Housing Bond Funds, CIP Funds, and Surplus Property Application
Category: Purchasing
Status: Closed


RFP in pdf

Bond Application Workshop 7-26-2023

Addendum No 1

Addendum No 2

Addendum No 3

Publication Date/Time:
7/10/2023 5:00 PM
Closing Date/Time:
9/28/2023 2:00 PM
Submittal Information:
Contact: Jovana Amaro 919-245-2651

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